LOCTITE LF318 97SC X 600GM
LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high-speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.
Qualities and Characteristics
- Good humidity resistance. Gives excellent coalescence even after 72 hours of exposure to 27ºC/80% RH, reducing process variation due to environmental factors
- colourless residues for easy post-reflow inspection
- Soft, non-stick, pin testable residues allow easy in-circuit testing
- Suitable for fine pitch, high-speed printing up to 150mm/s (6""/s)
Technical Attributes
| Viscosity Temperature | 77 °F |
| Shelf Life Temperature | 32 - 50 °F |
| Thixotropic Index | 0.54 |
| Filler | 88.5 |
| Storage Temperature | 32 - 50 °F |
Physical Attributes
| Viscosity | 765000 - 886000 mPa.s (cP) Brookfield |
| Colour | Grey |
Practical Attributes
| Application | Stencil Printing |
Write Your Own Review
Call for price
LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing.
