LOCTITE SN62MP218DAP89.5V AAU X 500G
LOCTITE® MP 218 SN62MP218DAP89.5V AAU X 500G is a high activity, soft residue, colourless, leaded solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including Rheometric Pump, Proflow, large and high-density.
Qualities and Characteristics
- Outstanding humidity resistance - gives excellent coalescence even after 24 hours exposure to 75% RH, thus reducing process variation due to environmental conditions
- colourless residues for easy post-reflow inspection
- Soft, non-stick, pin testable residues allow easy in-circuit testing
- Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)
- Flux: MP218
- Alloy: Sn62
- Powder Size: DAP/T4
- Metal Load: 89.5
- Shelf Life: 183 (Product must remain cold)
Technical Attributes
| Viscosity Temperature | 25 °C |
| Thixotropic Index | 0.52 |
Physical Attributes
| Viscosity | 840000 - 950000 mPa.s (cP) Brookfield |
| Physical Form | Paste |
| Colour | Grey |
Practical Attributes
| Agency Approvals | IPC/J-STD-004 Classification – ROLO |
| Application | paste |
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LOCTITE® SN62MP218DAP89.5V AAU X 500G
