LOCTITE 3513 X 30ML
LOCTITE® 3513 is a single component epoxy adhesive. It is designed for use as a reworkable underfill resin for CSP(FBGA) or BGA, and it cures rapidly on exposure to heat. Also, it gives give excellent protection from failure due to mechanical stress, and the low viscosity allows filling in gaps under CSP or BGA.
Qualities and Characteristics
- Single component
- Cures rapidly with heat exposure
- Low viscosity
Technical Attributes
| Cure Method | Heat, high speed |
Physical Attributes
| Capacity | 30ml |
| Colour | Opaque cream yellow |
| Technology | Epoxy |
Practical Attributes
| Key Substrates | SMD components to PCB |
| Dispense Method | Syringe |
| Application | Underfill |
| Specific Application | Reworkable underfill for CSP (FBGA) or BGA |
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£64.00
(£76.80
inc VAT)
LOCTITE® 3513 is a single component epoxy adhesive, designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
